> logic technology can extend for the first time below the 1 nm node, advancing the era of angstrom-level scaling, where dimensions approach the size of individual atoms. While transistor nodes now refer to a generation of manufacturing technology versus an exact physical dimension, IBM’s 0.7 nm technology—also referred to as 7 angstroms—demonstrates how continued scaling remains possible.
Continuing the well established trend of making bold claims about physical dimensions that have nothing to do with any of the structures in the chip, and the name scales better than the tech.
What they actually deliver is a "nanostack architecture" built with ~5nm features that according to them is comparable to a hypothetical real sub-1nm chip.
It's an impressive achievement nonetheless but it looks like the industry has a few too many marketers.
It's been decades since published node sizes had any connection to actual feature size. Sadly this is just how it works in the semiconductor industry now.
As it can be seen from the photos, horizontally the features are much bigger than 5 nm.
For silicon, the gate length of a FET has a lower limit somewhere between 10 nm and 15 nm.
The current CMOS manufacturing processes have not reached the limit yet. For making smaller transistors, a transition to other semiconductor materials will be necessary.
The vertical thicknesses of various layers may be of only a few nanometers or even of a fraction of a nanometer, but that does not matter directly for the circuit density.
The supposed node size refers to horizontal dimensions, not to vertical dimensions.
Vertical dimensions of around 1 nanometer or less could be achieved already many decades ago, because they depend on growth speed and on time, not on lithography, like the horizontal dimensions.
The industry should have stopped decades ago to talk about the "size" but they should have characterized a CMOS process by its density, e.g. in logic gates per square mm.
However, an actual concrete number would be disliked by marketing, because they could no longer claim that their "1 nm" process is better than the "2 nm" process of another vendor, if their density is not really better.
My read on it was that they are trying to imply a transistor density (in a 2D plane sense) that is comparable to a 1nm process? But they achieve that through stacking (3D, not 2D) since the features aren't actually anywhere near 1nm?
> Continuing the well established trend of making bold claims about physical dimensions that have nothing to do with any of the structures in the chip, and the name scales better than the tech.
We care about PPA (power, performance, area) and not how large or not-large features actually are. Comparing gate lengths between a 1980s planar transistor and a 2010s 3D FinFET or GAA transistor is obviously nonsense, the relatively aligned node names of the industry actually do make sense as a shortcut here.
I really can't see where the 0.7nm is coming from. The white line looks like it's just an edge of a feature that is "15 rows of silicon atoms", which by some quick arithmetic on Wolfram Alpha has to be AT LEAST ~1.6nm, and the way the rows of atoms appear to be packed in that image and by the provided scale, it seems to be significantly more. Using the white line as a meaningful measurement seems to me to be more misleading than any other interpretation here.
Broadly speaking yes, this is the business model. IBM has been at this for many years with technology transfers, licensing agreements, support and other arrangements. Rapidus, Samsung, GlobalFoundries, ST, SMIC, AMD, etc. have all used IBM R&D work at various times for various nodes and products.
The cutting edge of semiconductors is a writhing mass of copulating tapeworms, and IBM lives deep inside that ball. For IBM, what this means is that when you buy one of the ASML machines to make products with this process, you'll pay IBM for the knowledge and support to actually get it working, or give them a cut, or something else, TBD, as circumstances warrant.
I’m sure they will license it. It’s better for them if everyone in the industry can innovate on everything around it. All the process tech companies will make it more cost effective, for instance, which helps IBM as well.
I always feel like I'm not quite getting quantum stuff no matter how much I read and learn: what does this advancement have to do with quantum computers?
> IBM and its partners conduct this work at a leading semiconductor research facility in Albany, New York, which will soon be home to a High Numerical Aperture Extreme Ultraviolet (High NA EUV) lithography tool, essential for the future of logic scaling. Developed by ASML, this technology enables ultra‑precise circuit printing, supporting the creation of smaller, more powerful chips.
I'm guessing that this is the technology that is developed by Cymer (ASML subsidiary) in California, correct? Is there competing technology? I know xLight is trying to make some inroads on their own version of this EUV tech. I have not heard about any progress though.
Yes, and we're already there. We've been there for quite a while, in fact.
Once you make the gate of a transistor small/thin enough, quantum effects take over. Electrons will randomly teleport into and through the gate causing the transistor to conduct when it shouldn't. I don't have numbers to hand, but it's on the order of a few atoms wide. There's really nothing that can be done about it either, as far as we know. Electrons just aren't physical objects at this scale, you can't simply exclude them from any given volume of space. The electron wave function will simply just appear wherever it wants (within the electron probability cloud). The only way to stop it is to make your insulating junction thicker than the probability cloud.
I mean, you can't get smaller than an atom, there is some amount of plausibility of using individual atoms as at least the occasional computing element.
Beyond that, engineering a quark-gluon plasma as a processor? I'd watch that Star Trek episode. (we might fantasize about stuff like that but we're roughly monkeys smashing rocks together in a cave vs. building an iPhone sort of gap away from that kind of thing unless somebody has a really good idea)
You could, in principle, use photons and/or electrons. We got pretty damn close in the vacuum tube era, and photonic computing has been a popular research topic for a while.
You also have quantum computing, which I think can/does use subatomic particles? Not sure about that one
For anyone who needs it, a friendly reminder that CPU nm marketing is a complete fabrication and the physical size of transistors has zero relation to the marketing claims. These are not, in fact, physically sub 1 nm, despite the bombastic claims.
At some point in the transistor scaling, the electrons started leaking across the gate, we've switched from 2D design to 3D structures to prevent that, so the actual physical gate pitch for like the TSMC 3nm is around 45 nm in distance.
Currently thrown around numbers mean the "equivalent performance/density" or something like that.
They don't describe the exact physical size (that would rather defeat the point of the marketing), but you can see the photographs at the bottom have a scale measured in tens of nm.
IBM regularly announces silicon breakthroughs like this but I'm not aware of those ever becoming products. Is IBM mainly in the business of licensing their technology to big silicon manufacturers with stuff like this? Is it just marketing for their consulting business?
IBM Z series mainframe Telum CPUs are designed by IBM but manufactured by Samsung. IBM no longer owns any fabs. I assume they have some kind of technology licensing deal.
It's a lab. It's where ASML brings up the prototype machine and gets it working, with IBM talent working out the problems and getting it ready for commercial operation. They won't make chips at scale there: the facility isn't designed for that part. The thing to understand here is that isn't a simple, clean, comprehensible business arrangement. The Albany facility is highly subsidized by the state. IBM has their hooks deep in the operation and occupation of the site. Such facilities are extraordinary with capabilities that talent that are unique and fabulously expensive. That's why ASML is there, and not just doing it in some village in the Netherlands. It's why when Obama, Biden, Trump or whomever tells ASML to whom they will and won't be selling hardware, ASML listens.
> It's why when Obama, Biden, Trump or whomever tells ASML to whom they will and won't be selling hardware, ASML listens.
My understanding is that ASML's acquisition of Cymer in California (the actual EUV light source technology) in 2014 was only permitted under a strict technology sharing and export agreement with the US government. And that the technology development and production had to remain within the US.
The USA CHIPS Act and NY State have provided $100 billion+ in funding with the expectation that ASML's core R&D and "prototyping" like this will be done in the US in partnership with US companies (like IBM).
A little bit of a nitpick, but wouldn't that be a picometer instead of angstrom node? Like, isn't a "pico-" the next magnitude smaller than "nano-", or am i wrong?
Otherwise, that chip tech sounds really awesome - at least for the future!
Useless fact I just learned from Wikipedia: Ångström/Angstrom (in Sweden of course we still use the original spelling) has its own UNICODE symbol, Angstrom sign: Å (U+212B) not to confuse with the Swedish letter Å (U+00C5). Looks slightly different in my browser.
Looks like that's deprecated. From the next sentence:
However, version 5 of the standard already deprecates that code point and has it normalized into the code for the Swedish letter U+00C5 Å `latin capital letter a with ring above`
You had the right idea. Angstroms are not an SI unit. The SI units jump by three orders of magnitude at this scale: picometer, nanometer, micrometer, millimeter.
(In the same way that meter jumps three orders of magnitude to kilometer[1], or millions to billions to trillions, etc.)
[1] Technically there are intermediate SI units between meter and km but nobody uses them. There are not intermediate SI units between the tiny ones.
Everyday necessity. The gap between mm and m is too large, there are many things in daily life that are better expressed in cm. SI units must strike a balance between three factors: not having so many denominations nobody can remember them; not having so few denominations that using them adds too much wordiness to daily life (150mm or 0.15m are wordier than 15cm); and a degree of familiarity with the everyday units people used before metric, to smooth the transition and encourage adoption.
Continuing the well established trend of making bold claims about physical dimensions that have nothing to do with any of the structures in the chip, and the name scales better than the tech.
What they actually deliver is a "nanostack architecture" built with ~5nm features that according to them is comparable to a hypothetical real sub-1nm chip.
It's an impressive achievement nonetheless but it looks like the industry has a few too many marketers.
For silicon, the gate length of a FET has a lower limit somewhere between 10 nm and 15 nm.
The current CMOS manufacturing processes have not reached the limit yet. For making smaller transistors, a transition to other semiconductor materials will be necessary.
The vertical thicknesses of various layers may be of only a few nanometers or even of a fraction of a nanometer, but that does not matter directly for the circuit density.
The supposed node size refers to horizontal dimensions, not to vertical dimensions.
Vertical dimensions of around 1 nanometer or less could be achieved already many decades ago, because they depend on growth speed and on time, not on lithography, like the horizontal dimensions.
The industry should have stopped decades ago to talk about the "size" but they should have characterized a CMOS process by its density, e.g. in logic gates per square mm.
However, an actual concrete number would be disliked by marketing, because they could no longer claim that their "1 nm" process is better than the "2 nm" process of another vendor, if their density is not really better.
I know they won't go for an anything that makes as much sense as 5nm3, so I vote for "1nm hyper space"
We care about PPA (power, performance, area) and not how large or not-large features actually are. Comparing gate lengths between a 1980s planar transistor and a 2010s 3D FinFET or GAA transistor is obviously nonsense, the relatively aligned node names of the industry actually do make sense as a shortcut here.
Broadly speaking yes, this is the business model. IBM has been at this for many years with technology transfers, licensing agreements, support and other arrangements. Rapidus, Samsung, GlobalFoundries, ST, SMIC, AMD, etc. have all used IBM R&D work at various times for various nodes and products.
The cutting edge of semiconductors is a writhing mass of copulating tapeworms, and IBM lives deep inside that ball. For IBM, what this means is that when you buy one of the ASML machines to make products with this process, you'll pay IBM for the knowledge and support to actually get it working, or give them a cut, or something else, TBD, as circumstances warrant.
I'm guessing that this is the technology that is developed by Cymer (ASML subsidiary) in California, correct? Is there competing technology? I know xLight is trying to make some inroads on their own version of this EUV tech. I have not heard about any progress though.
Is there a limit to how small things can go? A single atom?
Is there a physical/molecular limit to Moore's Law?
Once you make the gate of a transistor small/thin enough, quantum effects take over. Electrons will randomly teleport into and through the gate causing the transistor to conduct when it shouldn't. I don't have numbers to hand, but it's on the order of a few atoms wide. There's really nothing that can be done about it either, as far as we know. Electrons just aren't physical objects at this scale, you can't simply exclude them from any given volume of space. The electron wave function will simply just appear wherever it wants (within the electron probability cloud). The only way to stop it is to make your insulating junction thicker than the probability cloud.
https://en.wikipedia.org/wiki/Landauer%27s_principle
Yes, single-atom manipulation has already been demonstrated:
* https://en.wikipedia.org/wiki/IBM_(atoms)
Can you make transistors using that technique? Can you smaller?
Beyond that, engineering a quark-gluon plasma as a processor? I'd watch that Star Trek episode. (we might fantasize about stuff like that but we're roughly monkeys smashing rocks together in a cave vs. building an iPhone sort of gap away from that kind of thing unless somebody has a really good idea)
You also have quantum computing, which I think can/does use subatomic particles? Not sure about that one
Why? What's their real size?
Not doubting you, just trying to understand and also trying to assess how exaggerated the marketing is.
Currently thrown around numbers mean the "equivalent performance/density" or something like that.
So many breakthroughs in hard drives, chips, transistor density, and other aspects of computing have come out of their labs.
Great to see them continuing to innovate.
But, yeah, usually they partner and license. Over the years, they've spun off more and more of their hardware businesses.
I wonder why isn't this more common.
https://www.ibm.com/products/z/telum
Per IBM: "IBM Research at Albany [...] includes more than 100,000 square feet of semiconductor fabrication space"
I guess that is technically a R&D fab not a production one, but they definitely have in house fabrication capability
My understanding is that ASML's acquisition of Cymer in California (the actual EUV light source technology) in 2014 was only permitted under a strict technology sharing and export agreement with the US government. And that the technology development and production had to remain within the US.
The USA CHIPS Act and NY State have provided $100 billion+ in funding with the expectation that ASML's core R&D and "prototyping" like this will be done in the US in partnership with US companies (like IBM).
Otherwise, that chip tech sounds really awesome - at least for the future!
https://en.wikipedia.org/wiki/Angstrom
However, version 5 of the standard already deprecates that code point and has it normalized into the code for the Swedish letter U+00C5 Å `latin capital letter a with ring above`
(In the same way that meter jumps three orders of magnitude to kilometer[1], or millions to billions to trillions, etc.)
[1] Technically there are intermediate SI units between meter and km but nobody uses them. There are not intermediate SI units between the tiny ones.
We have centimeter (10 mm) then decimeter (100mm) then meter (1000mm). Then we jump to thousand again (kilometer).
Does anyone actually use those? I think I would throw up a little in my mouth if I saw either of those on a mechanical drawing.
1 Å = 100 pm. 1 pm = 0.01 Å.
1 angstrom = 0.1 nanometers, 100 picometers
1 nanometer = 10 angstroms, 1000 picometers